IP Library › Granted Patent US 6,762,076
Granted Patent Utility
US 6,762,076 · App. 10/077,967

Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices

Inventors: Sarah Kim, R. Scott List, Scot Kellar
Patented Case View Patent ↗
Granted: Jul 13, 2004 Filed: Feb 20, 2002
Inventors
Sarah Kim
R. Scott List
Scot Kellar
Assignee (at issue)
Intel Corporation

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Quick Facts
Patent No.
US 6,762,076
App. No.
10/077,967
Filed
2002-02-20
Granted
2004-07-13
Kind
B2