Granted Patent
Utility
US 6,762,078 · App. 09/774,952
Semiconductor package having semiconductor chip within central aperture of substrate
Inventors:
WonSun Shin, DoSung Chun, Sangho Lee, SeonGoo Lee, Vincent DiCaprio
Patented Case
View Patent ↗
Granted: Jul 13, 2004
Filed: Jan 30, 2001
Inventors
WonSun Shin
DoSung Chun
Sangho Lee
SeonGoo Lee
Vincent DiCaprio
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.