Granted Patent
Utility
US 6,764,878 · App. 10/193,289
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
Inventors:
Atsushi Fujisawa, Takafumi Konno, Shingo Ohsaka, Ryo Haruta, Masahiro Ichitani
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: Jul 12, 2002
Inventors
Atsushi Fujisawa
Takafumi Konno
Shingo Ohsaka
Ryo Haruta
Masahiro Ichitani
Assignees (at issue)
Renesas Technology Corporation
Hitachi Hokkai Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.