Granted Patent
Utility
US 6,764,882 · App. 10/213,029
Two-stage transfer molding method to encapsulate MMC module
Inventor:
Todd O. Bolken
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: Aug 5, 2002
Inventor
Todd O. Bolken
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.