Granted Patent
Utility
US 6,764,923 · App. 10/145,172
Method for manufacturing components of an SOI wafer
Inventors:
Harry Dietrich, Volker Dudek, Andreas Paul Schueppen
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: May 13, 2002
Inventors
Harry Dietrich
Volker Dudek
Andreas Paul Schueppen
Assignee (at issue)
ATMEL Germany GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.