Granted Patent
Utility
US 6,765,301 · App. 10/212,106
Integrated circuit bonding device and manufacturing method thereof
Inventors:
Chung-Ju Wu, Kuei-Chen Liang, Wei-Feng Lin
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: Aug 6, 2002
Inventors
Chung-Ju Wu
Kuei-Chen Liang
Wei-Feng Lin
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.