Granted Patent
Utility
US 6,765,398 · App. 10/428,703
Conductive material for integrated circuit fabrication
Inventor:
Yungjun Jeff Hu
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: May 2, 2003
Inventor
Yungjun Jeff Hu
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.