Granted Patent
Utility
US 6,765,666 · App. 09/631,509
System and method for inspecting bumped wafers
Inventors:
Clyde Maxwell Guest, Younes Chtioui, Rajiv Roy, Charles K. Harris, Weerakiat Wahawisan, Thomas Casey Carrington
Patented Case
View Patent ↗
Granted: Jul 20, 2004
Filed: Aug 3, 2000
Inventors
Clyde Maxwell Guest
Younes Chtioui
Rajiv Roy
Charles K. Harris
Weerakiat Wahawisan
Thomas Casey Carrington
Assignee (at issue)
SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS PTE LTD (SG)
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.