Granted Patent
Utility
US 6,770,164 · App. 09/649,827
Method for attaching a semiconductor die to a substrate
Inventors:
Edward A. Schrock, Tongbi Jiang
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: Aug 29, 2000
Inventors
Edward A. Schrock
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.