IP Library Granted Patent US 6,770,421
Granted Patent Utility
US 6,770,421 · App. 09/996,938

Photo- or heat-curable resin composition and multilayer printed wiring board

Inventors: Masahiko Takeuchi, Kazuhiko Mizuuchi, Hironobu Kawasato
Patented Case View Patent ↗
Granted: Aug 3, 2004 Filed: Nov 30, 2001
Inventors
Masahiko Takeuchi
Kazuhiko Mizuuchi
Hironobu Kawasato
Assignee (at issue)
NIPPON STEEL CHEMICAL CO., LTD.

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Quick Facts
Patent No.
US 6,770,421
App. No.
09/996,938
Filed
2001-11-30
Granted
2004-08-03
Kind
B2