Granted Patent
Utility
US 6,770,558 · App. 10/371,466
Selective filling of electrically conductive vias for three dimensional device structures
Inventors:
Emmanuel Delamarche, Michel Despont, Ute Drechsler, Matthias Geissler
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: Feb 21, 2003
Inventors
Emmanuel Delamarche
Michel Despont
Ute Drechsler
Matthias Geissler
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.