Granted Patent
Utility
US 6,770,842 · App. 10/176,041
Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam
Inventors:
Hyung-Woo Nam, Dae-Ho Choo, Baek-Kyun Jeon
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: Jun 21, 2002
Inventors
Hyung-Woo Nam
Dae-Ho Choo
Baek-Kyun Jeon
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.