Granted Patent
Utility
US 6,770,963 · App. 09/754,900
Multi-power ring chip scale package for system level integration
Inventor:
Ping-Chang Wu
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: Jan 4, 2001
Inventor
Ping-Chang Wu
Assignee (at issue)
Broadcom Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.