Granted Patent
Utility
US 6,770,973 · App. 09/850,254
Semiconductor apparatus including a multi-layer wiring configuration and manufacturing method therefor
Inventor:
Hisamitsu Kimoto
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: May 7, 2001
Inventor
Hisamitsu Kimoto
Assignees (at issue)
NEC CORPORATION
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.