Granted Patent
Utility
US 6,770,981 · App. 10/373,261
Composite interposer for BGA packages
Inventors:
Tongbi Jiang, Edward A. Schrock
Patented Case
View Patent ↗
Granted: Aug 3, 2004
Filed: Feb 24, 2003
Inventors
Tongbi Jiang
Edward A. Schrock
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.