IP Library › Granted Patent US 6,772,509
Granted Patent Utility
US 6,772,509 · App. 10/058,650

Method of separating and handling a thin semiconductor die on a wafer

Inventors: Shiuh-Hui Steven Chen, Cheryl Field, Didier Lefebvre, Joe Wang
Patented Case View Patent ↗
Granted: Aug 10, 2004 Filed: Jan 28, 2002
Inventors
Shiuh-Hui Steven Chen
Cheryl Field
Didier Lefebvre
Joe Wang
Assignee (at issue)
Motorola, Inc.

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Quick Facts
Patent No.
US 6,772,509
App. No.
10/058,650
Filed
2002-01-28
Granted
2004-08-10
Kind
B2