IP Library Granted Patent US 6,773,543
Granted Patent Utility
US 6,773,543 · App. 10/430,621

Method and apparatus for the multiplexed acquisition of a bare die from a wafer

Inventor: Michael Summers
Patented Case View Patent ↗
Granted: Aug 10, 2004 Filed: May 6, 2003
Inventor
Michael Summers
Assignee (at issue)
Delaware Capital Formation, Inc.

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Quick Facts
Patent No.
US 6,773,543
App. No.
10/430,621
Filed
2003-05-06
Granted
2004-08-10
Kind
B2