Granted Patent
Utility
US 6,774,033 · App. 10/287,258
Metal stack for local interconnect layer
Inventors:
Mira Ben-Tzur, Dafna Beery, Gorley Lau, Krishnaswamy Ramkumar
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Nov 4, 2002
Inventors
Mira Ben-Tzur
Dafna Beery
Gorley Lau
Krishnaswamy Ramkumar
Assignee (at issue)
Cypress Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.