Granted Patent
Utility
US 6,774,465 · App. 10/265,081
Semiconductor power package module
Inventors:
Keun-hyuk Lee, Ji Hwan Kim, Dae-Woong Chung, O-seob Jeon
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Oct 4, 2002
Inventors
Keun-hyuk Lee
Ji Hwan Kim
Dae-Woong Chung
O-seob Jeon
Assignee (at issue)
Fairchild Korea Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.