Granted Patent
Utility
US 6,774,477 · App. 10/331,023
Structure and method of stacking multiple semiconductor substrates of a composite semiconductor device
Inventor:
Il-Seok Han
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Dec 27, 2002
Inventor
Il-Seok Han
Assignee (at issue)
SK hynix Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.