Granted Patent
Utility
US 6,774,480 · App. 09/365,356
Method and structure for manufacturing improved yield semiconductor packaged devices
Inventor:
Tongbi Jiang
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Jul 30, 1999
Inventor
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.