Granted Patent
Utility
US 6,774,497 · App. 10/402,631
Flip-chip assembly with thin underfill and thick solder mask
Inventors:
Jing Qi, Janice Danvir, Tomasz L. Klosowiak, Prasanna Kulkarni, Nadia Yala
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: Mar 28, 2003
Inventors
Jing Qi
Janice Danvir
Tomasz L. Klosowiak
Prasanna Kulkarni
Nadia Yala
Assignee (at issue)
Freeescale Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.