Granted Patent
Utility
US 6,775,140 · App. 10/434,256
Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
Inventors:
Il Kwon Shim, Seng Guan Chow, Virgil Ararao, Sheila Marie L. Alvarez, Roger Emigh
Patented Case
View Patent ↗
Granted: Aug 10, 2004
Filed: May 7, 2003
Inventors
Il Kwon Shim
Seng Guan Chow
Virgil Ararao
Sheila Marie L. Alvarez
Roger Emigh
Assignee (at issue)
ST ASSEMBLY TEST SERVICES LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.