Granted Patent
Utility
US 6,776,893 · App. 09/716,975
Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
Inventors:
Elena H. Too, Paul R. Gerst, Vincent Paneccasio, Jr., Richard Hurtubise
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Nov 20, 2000
Inventors
Elena H. Too
Paul R. Gerst
Vincent Paneccasio, Jr.
Richard Hurtubise
Assignee (at issue)
Enthone GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.