Granted Patent
Utility
US 6,777,263 · App. 10/647,040
Film deposition to enhance sealing yield of microcap wafer-level package with vias
Inventors:
Qing-Cao Gan, Richard C. Ruby, Frank S. Geefay, Andrew Thomas Barfknecht
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Aug 21, 2003
Inventors
Qing-Cao Gan
Richard C. Ruby
Frank S. Geefay
Andrew Thomas Barfknecht
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.