Granted Patent
Utility
US 6,777,326 · App. 10/330,060
Method for forming multi-layer metal line of semiconductor device
Inventor:
Jun Ho Yoon
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Dec 30, 2002
Inventor
Jun Ho Yoon
Assignee (at issue)
SK hynix Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.