Granted Patent
Utility
US 6,777,328 · App. 10/187,840
Method of forming multilayered conductive layers for semiconductor device
Inventor:
Tetsuo Usami
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Jul 3, 2002
Inventor
Tetsuo Usami
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.