Granted Patent
Utility
US 6,777,337 · App. 09/910,904
Planarizing method of semiconductor wafer and apparatus thereof
Inventors:
Kan Yasui, Souichi Katagiri, Masayuki Nagasawa, Ui Yamaguchi, Yoshio Kawamura
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Jul 24, 2001
Inventors
Kan Yasui
Souichi Katagiri
Masayuki Nagasawa
Ui Yamaguchi
Yoshio Kawamura
Assignee (at issue)
Renesas Technology Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.