Granted Patent
Utility
US 6,777,802 · App. 10/164,494
Integrated circuit package substrate with multiple voltage supplies
Inventors:
Leonard L. Mora, Abi Awujoola, Ed Fulcher
Patented Case
View Patent ↗
Granted: Aug 17, 2004
Filed: Jun 6, 2002
Inventors
Leonard L. Mora
Abi Awujoola
Ed Fulcher
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.