Granted Patent
Utility
US 6,779,260 · App. 10/401,850
Overmolded electronic package including circuit-carrying substrate
Inventors:
Scott D. Brandenburg, Thomas A. Degenkolb, Bruce A. Myers
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Mar 28, 2003
Inventors
Scott D. Brandenburg
Thomas A. Degenkolb
Bruce A. Myers
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.