Granted Patent
Utility
US 6,780,682 · App. 10/081,425
Process for precise encapsulation of flip chip interconnects
Inventor:
Rajendra D. Pendse
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Feb 22, 2002
Inventor
Rajendra D. Pendse
Assignee (at issue)
ChipPAC, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.