Granted Patent
Utility
US 6,780,733 · App. 10/236,619
Thinned semiconductor wafer and die and corresponding method
Inventors:
Marc Chason, Paul Brazis, Krishna Kalyanasundaram, Daniel Gamota
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Sep 6, 2002
Inventors
Marc Chason
Paul Brazis
Krishna Kalyanasundaram
Daniel Gamota
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.