Granted Patent
Utility
US 6,780,751 · App. 10/267,453
Method for eliminating voiding in plated solder
Inventor:
Owen R. Fay
Patented Case
View Patent ↗
Granted: Aug 24, 2004
Filed: Oct 9, 2002
Inventor
Owen R. Fay
Assignee (at issue)
Freeescale Semiconductor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.