IP Library › Granted Patent US 6,780,764
Granted Patent Utility
US 6,780,764 · App. 10/316,852

Method of forming a patterned tungsten damascene interconnect

Inventors: Tomoyuki Morita, Yusuke Harada
Patented Case View Patent ↗
Granted: Aug 24, 2004 Filed: Dec 12, 2002
Inventors
Tomoyuki Morita
Yusuke Harada
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

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Quick Facts
Patent No.
US 6,780,764
App. No.
10/316,852
Filed
2002-12-12
Granted
2004-08-24
Kind
B2