Granted Patent
Utility
US 6,784,376 · App. 09/931,144
Solderable injection-molded integrated circuit substrate and method therefor
Inventors:
Ronald Patrick Huemoeller, Sukianto Rusli
Patented Case
View Patent ↗
Granted: Aug 31, 2004
Filed: Aug 16, 2001
Inventors
Ronald Patrick Huemoeller
Sukianto Rusli
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.