Granted Patent
Utility
US 6,786,809 · App. 09/823,446
Wafer carrier, wafer carrier components, and CMP system for polishing a semiconductor topography
Inventor:
Ruediger Held
Patented Case
View Patent ↗
Granted: Sep 7, 2004
Filed: Mar 30, 2001
Inventor
Ruediger Held
Assignee (at issue)
Cypress Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.