Granted Patent
Utility
US 6,790,710 · App. 10/062,650
Method of manufacturing an integrated circuit package
Inventors:
Neil McLellan, Chun Ho Fan, Edward Combs, Tsang Cheung, Chow Keung, Sadak Thamby Labeeb
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: Jan 31, 2002
Inventors
Neil McLellan
Chun Ho Fan
Edward Combs
Tsang Cheung
Chow Keung
Sadak Thamby Labeeb
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.