Granted Patent
Utility
US 6,790,767 · App. 10/306,491
Method for formation of copper diffusion barrier film using aluminum
Inventor:
Jae-Suk Lee
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: Nov 27, 2002
Inventor
Jae-Suk Lee
Assignee (at issue)
Dongbu Electronics, Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.