Granted Patent
Utility
US 6,791,177 · App. 10/435,805
Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate
Inventors:
Leah M. Miller, Aritharan Thurairajaratnam, Edwin M. Fulcher
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: May 12, 2003
Inventors
Leah M. Miller
Aritharan Thurairajaratnam
Edwin M. Fulcher
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.