Granted Patent
Utility
US 6,791,192 · App. 10/371,506
Multiple chips bonded to packaging structure with low noise and multiple selectable functions
Inventors:
Mou-Shiung Lin, Bryan Peng
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: Feb 21, 2003
Inventors
Mou-Shiung Lin
Bryan Peng
Assignee (at issue)
Megica Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.