Granted Patent
Utility
US 6,791,255 · App. 10/234,745
High coefficient of thermal expansion spacer structure materials
Inventors:
Timothy A. Derouin, Sudhakar Gopalakrishnan
Patented Case
View Patent ↗
Granted: Sep 14, 2004
Filed: Sep 4, 2002
Inventors
Timothy A. Derouin
Sudhakar Gopalakrishnan
Assignees (at issue)
Candescent Intellectual Property Services, Inc.
Candescent Technologies Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.