Granted Patent
Utility
US 6,793,116 · App. 10/255,373
Solder ball and interconnection structure using the same
Inventor:
Tomoko Harada
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: Sep 26, 2002
Inventor
Tomoko Harada
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.