Granted Patent
Utility
US 6,793,323 · App. 10/129,437
Thermal expansion compensation for modular printhead assembly
Inventor:
Kia Silverbrook
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: May 6, 2002
Inventor
Kia Silverbrook
Assignee (at issue)
Silverbrook Research Pty Ltd
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.