Granted Patent
Utility
US 6,793,837 · App. 10/174,139
Process for material-removing machining of both sides of semiconductor wafers
Inventors:
Guido Wenski, Thomas Altmann, Gerhard Heier, Wolfgang Winkler, Gunther Kann
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: Jun 18, 2002
Inventors
Guido Wenski
Thomas Altmann
Gerhard Heier
Wolfgang Winkler
Gunther Kann
Assignee (at issue)
SILTRONIC AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.