Granted Patent
Utility
US 6,794,236 · App. 10/160,855
Eeprom device with improved capacitive coupling and fabrication process
Inventor:
YongZhong Hu
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: Jun 3, 2002
Inventor
YongZhong Hu
Assignee (at issue)
Lattice Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.