Granted Patent
Utility
US 6,794,745 · App. 09/710,606
Lead on chip type semiconductor package
Inventor:
Jong Myoung Lee
Patented Case
View Patent ↗
Granted: Sep 21, 2004
Filed: Nov 10, 2000
Inventor
Jong Myoung Lee
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.