Granted Patent
Utility
US 6,797,625 · App. 10/306,238
Method of forming a protective step on the edge of a semiconductor wafer
Inventors:
Chang-gyu Kim, Wan-Shick Kim
Patented Case
View Patent ↗
Granted: Sep 28, 2004
Filed: Nov 27, 2002
Inventors
Chang-gyu Kim
Wan-Shick Kim
Assignee (at issue)
Dongbu Electronics, Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.