Granted Patent
Utility
US 6,797,882 · App. 09/978,772
Die package for connection to a substrate
Inventors:
Stanford W. Crane, Jr., Myoung-soo Jeon, Charley T. Ogata
Patented Case
View Patent ↗
Granted: Sep 28, 2004
Filed: Oct 18, 2001
Inventors
Stanford W. Crane, Jr.
Myoung-soo Jeon
Charley T. Ogata
Assignee (at issue)
Silicon Bandwidth, Inc.,
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.