Granted Patent
Utility
US 6,798,504 · App. 09/961,513
Apparatus and method for inspecting surface of semiconductor wafer or the like
Inventors:
Tatsuya Sato, Yuichiro Kato, Kenji Mitomo
Patented Case
View Patent ↗
Granted: Sep 28, 2004
Filed: Sep 24, 2001
Inventors
Tatsuya Sato
Yuichiro Kato
Kenji Mitomo
Assignee (at issue)
Hitachi High-Tech Electronics Engineering Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.