Granted Patent
Utility
US 6,798,667 · App. 10/064,857
Solder ball collapse control apparatus and method thereof
Inventor:
Vincent Chan
Patented Case
View Patent ↗
Granted: Sep 28, 2004
Filed: Aug 23, 2002
Inventor
Vincent Chan
Assignee (at issue)
ATI Technologies Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.